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HL Series

HL-NS-355-20-S

With the unique cold processing advantage of UV light, it is widely used for cutting, drilling, marking and etching of materials in the high-end market of ultra-fine processing.

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Features

Modular design for easy upgrade and maintenance

TEM00 mode output

Adjustable repetition rate

Applications

Solar Cell Process

PCB/FPC board marking, cutting and drilling

Ink removal, PVD layer removal

Scribing, cutting and drilling of ceramics

Wafer scribing

Sample Display

Stainless steel coloring

PCB cutting

GPP type wafer cutting

Fireproof materials marking

Stainless steel coloring

PCB cutting

Fireproof materials marking

Parameters

HL-NS-355-20-S
Output Characteristics
Wavelength	355 nm
Max Power	20 W@80 kHz
Repetition Rate	60 kHz~200 kHz
Pulse Width	20 ns-100 ns
Pulse Energy Stability (rms)	< 3% rms@80 kHz
Power Stability	< 2% rms
Beam Characteristics
Spatial Mode	TEM00
Beam Quality	M2 < 1.3
Polarization Ratio	> 100:1 (horizontal)
Beam Diameter at Exit	1.4 mm ± 0.2 mm
Divergence Full Angle (1/e²)	< 2 mrad
Circularity	> 90%
Beam Pointing Stability	≤ ± 25 μrad/℃
Working Conditions/Environmental Requirements
Power Supply	24VDC ± 1V; ≥ 400W switching power supply
Warm-up Time	Standby to ready＜10 minutes; cold start to readiness < 30 minutes
Temperature Range	15~30°C during working hours; 0~50°C during non-working hours
Humidity Range	10~70%, non-condensation
Cooling Requirements	Water cooling, cooling capacity ≥ 500W, accuracy ± 0.1℃, flow rate ≥ 6L/min
Physical Properties
Laser Dimensions	598 mm×230 mm×154.7 mm (L x W x H)
Laser Weight	25 kg

Contact

Have a specific application challenge? Need a system quote or feasibility study? Our laser application experts are ready to collaborate.

We are here for you.

+49 (0) 7141 8535 0

information@hl-components.com

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HL-NS-355-20-S

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